Samsung’s Exynos 2700 SoC for Galaxy S27 series to reportedly ditch WLP technology

Samsung’s Exynos 2700: A Major Design Shift for the Galaxy S27?

We’re still a few years away from the launch of the Galaxy S27, but the rumor mill is already churning out fascinating details about the brain behind the device: the Exynos 2700. If recent industry reports are anything to go by, Samsung is planning a significant architectural shift that could change how its future chipsets handle heat and manufacturing costs.

Moving Away from FOWLP

For the past few generations, specifically since the Exynos 2400, Samsung has relied on Fan-Out Wafer-Level Packaging (FOWLP). It’s a mouthful, but this tech essentially helped keep chips thin while managing thermal performance effectively. So, why ditch it? It turns out that while FOWLP performs well, it’s also incredibly complex and expensive to produce. To improve profitability without sacrificing the user experience, Samsung is reportedly looking at a different path for its next flagship SoC.

The Rise of Side-by-Side (SbS) Packaging

According to industry insiders, the Exynos 2700 will likely adopt a Side-by-Side (SbS) packaging design. In simple terms, instead of stacking the DRAM (memory) directly on top of the Application Processor (AP), this new layout places them next to each other on the substrate. While stacking is great for saving space, the SbS approach can simplify the manufacturing process and potentially offer a more cost-effective way to manage internal components.

Keeping It Cool: Heat Pass Block Technology

Of course, any change in chip design raises questions about overheating—a ghost that has haunted Exynos chips in the past. To counter this, Samsung is expected to integrate its Heat Pass Block (HPB) technology. This cooling solution is designed to pull heat away from the core components more efficiently, ensuring that the Galaxy S27 can handle heavy gaming and multitasking without thermal throttling.

What This Means for the Galaxy S27

We expect the Exynos 2700 to power the standard Galaxy S27 and Galaxy S27+ when they eventually debut in early 2027. Whether this new SbS design and HPB integration will finally put Exynos on equal footing with its Snapdragon rivals remains to be seen. However, it’s clear that Samsung is getting creative with its hardware blueprint to balance power, heat, and production costs in its next generation of flagships.